io-port 50132309 Oprins, Herman;
Srinivasan, A.;
Cupák, Miroslav;
Cherman, Vladimir;
Torregiani, Cristina;
Stucchi, Michele;
Van Der Plas, Geert;
Marchal, Paul;
Vandevelde, Bart;
Cheng, E.
Fine grain thermal modeling and experimental validation of 3D-ics (English)
Microelectronics Journal 42, No. 4, 572-578 (2011).
1
DRAM-on-logic stack - calibrated thermal and mechanical models integrated into pathfinding flow (English)
CICC, 1-4 (2011).
2
io-port 70226587 Van Der Plas, Geert;
Thijs, Steven;
Linten, Dimitri;
Katti, Guruprasad;
Limaye, Paresh;
Mercha, Abdelkarim;
Stucchi, Michele;
Oprins, Herman;
Vandevelde, Bart;
Minas, Nikolaos;
Cupac, Miro;
Dehan, Morin;
Nelis, Marc;
Agarwal, Rahul;
Dehaene, Wim;
Travaly, Youssef;
Beyne, Eric;
Marchal, Paul
Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack - challenges and solutions (English)
CICC, 1-4 (2010).
3
3D integration: circuit design, test, and reliability challenges (English)
IOLTS, 217 (2010).
5
Convection heat transfer in electrostatic actuated liquid droplets for electronics cooling (English)
Microelectronics Journal 39, No. 7, 966-974 (2008).
6