Through silicon photonic via (TSPV) with si core for low loss and high-speed data transmission in opto-electronic 3-D LSI (English)
3DIC, 1-4 (2010).
1
Power saving cognitive radio lans for disaster information (English)
NBiS, 592-596 (2009).
2
Micro-Raman spectroscopy analysis and capacitance - time (C-t) measurement of thinned silicon substrates for 3D integration (English)
3DIC, 1-5 (2009).
3
io-port 70868220 Ohara, Yuki;
Noriki, Akihiro;
Sakuma, Katsuyuki;
Lee, Kang Wook;
Murugesan, Mariappan;
Bea, Jichoel;
Yamada, Fumiaki;
Fukushima, Takafumi;
Tanaka, Tetsu;
Koyanagi, Mitsumasa
10 $μm$ fine pitch cu/sn micro-bumps for 3-D super-chip stack (English)
3DIC, 1-6 (2009).
4
Disaster information system and its wireless recovery protocol (English)
SAINT Workshops, 223-228 (2004).
5
Wide area disaster information network and its resource management system (English)
AINA, 146-150 (2003).
6
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