Systems-in-foil - devices, fabrication processes and reliability issues (English)
Microelectronics Reliability 48, No. 8-9, 1123-1128 (2008).
1
Processing quality results for electroless/electroplating of high-aspect ratio plated through holes in industrially produced printed circuit boards (English)
Microelectronics Reliability 45, No. 3-4, 675-687 (2005).
2
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