Simulation and experimental analysis of large area substrate overmolding with epoxy molding compounds (English)
Microelectronics Reliability 51, No. 3, 668-675 (2011).
1
io-port 70998698 Alme, J.;
Richter, M.;
Larsen, D.;
Röhrich, Dieter;
Ullaland, K.;
Roed, K.;
Bablok, S.;
Keidel, R.;
Kofler, Ch.;
Krawutschke, T.;
Alt, T.;
Gottschalk, D.;
Hobbel, H.;
Kiworra, V.;
Lindenstruth, Volker;
Stockmeier, M. R.;
Frankenfeld, U.;
Campagnolo, R.;
Engster, C.;
Gutierrez, C. Gonzalez;
Junique, A.;
Mota, B.;
Musa, L.
A distributed, heterogeneous control system for the ALICE TPC electronics (English)
ICPP Workshops, 265-272 (2005).
2
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