io-port 50230264 Fukushima, Takafumi;
Konno, Takayuki;
Iwata, Eiji;
Kobayashi, Risato;
Kojima, Toshiya;
Murugesan, Mariappan;
Bea, Ji Chel;
Lee, Kang Wook;
Tanaka, Tetsu;
Koyanagi, Mitsumasa
Self-assembly of chip-size components with cavity structures: high-precision alignment and direct bonding without thermal compression for hetero integration (English)
Micromachines 2, No. 1, 49-68 (2011).
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