<?xml version="1.0" encoding="utf-8" standalone="yes"?>
<item>
  <id>70868251</id>
  <dt>a</dt>
  <an>70868251</an>
  <augroup>
    <au>Miyazaki, Chuichi</au>
    <au>Shimamoto, Haruo</au>
    <au>Uematsu, Toshihide</au>
    <au>Abe, Yoshiyuki</au>
    <au>Kitaichi, Kosuke</au>
    <au>Morifuji, Tadahiro</au>
    <au>Yasunaga, Shoji</au>
  </augroup>
  <ti>Development of high accuracy wafer thinning and pickup technology for thin wafer</ti>
  <so>3DIC, 1-4 (2010).</so>
  <py>2010</py>
  <pu></pu>
  <lagroup>
    <la>EN</la>
  </lagroup>
  <ccgroup>
  </ccgroup>
  <utgroup>
  </utgroup>
  <cigroup>
  </cigroup>
  <ligroup>
    <li>doi:10.1109/3DIC.2010.5751470</li>
  </ligroup>
</item>