id: 50234017
dt: j
an: 50234017
au: Guojun, Hu; Rossi, Roberto; Luan, Jing-En; Baraton, Xavier
ti: Interface delamination analysis of TQFP package during solder reflow
so: Microelectronics Reliability 50, No. 7, 1014-1020 (2010).
py: 2010
pu: 
la: EN
cc: 
ut: 
ci: 
li: doi:10.1016/j.microrel.2010.03.012