id: 70068495
dt: a
an: 70068495
au: Angermeier, Josef; Ziener, Daniel; Glaß, Michael; Teich, Jürgen
ti: Stress-aware module placement on reconfigurable devices
so: FPL, 277-281 (2011).
py: 2011
pu: 
la: EN
cc: 
ut: 
ci: 
li: http://doi.ieeecomputersociety.org/10.1109/FPL.2011.56