Thermal behavior spice study of 6H-sic NMOS transistors (English)
Microelectronics Journal 40, No. 6, 891-896 (2009).
1
Dimensional soft tissue thermal injury analysis using transmission line matrix (TLM) method. (English)
Int. J. Numer. Model. 21, No. 6, 531-549 (2008).
2
Effect of a magnetic field on the conduction mechanism in silicon $P^{+}$N junctions (English)
Microelectronics Journal 37, No. 2, 127-132 (2006).
3
Thermal behaviour of 6H-sic bipolar transistors: spice simulation and applications (English)
Microelectronics Journal 35, No. 5, 437-442 (2004).
4
Electrical characterizations of preamorphized junctions under LF magnetic field (English)
Microelectronics Journal 34, No. 11, 1059-1066 (2003).
5
Electrical characterization and modelling of high energy pre-amorphized $P^{+}$N silicon junctions (English)
Microelectronics Journal 34, No. 10, 955-959 (2003).
6
Using microchannels to cool microprocessors: a transmission-line-matrix study (English)
Microelectronics Journal 34, No. 4, 247-253 (2003).
7
Determination of passive $SiO_{2}$-au microstructure resonant frequencies (English)
Microelectronics Reliability 43, No. 9-11, 1951-1955 (2003).
8
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